{"id":13722,"date":"2026-05-21T17:01:21","date_gmt":"2026-05-21T15:01:21","guid":{"rendered":"https:\/\/www.encontec.de\/electronics-testing-laboratory-ipc-a-600-a-610\/test-laboratory-cross-sections-of-electronic-assemblies\/"},"modified":"2026-06-23T10:40:13","modified_gmt":"2026-06-23T08:40:13","slug":"test-laboratory-cross-sections-of-electronic-assemblies","status":"publish","type":"page","link":"https:\/\/www.encontec.de\/en\/testing-laboratory\/electronics-testing-laboratory-ipc-a-600-a-610\/test-laboratory-cross-sections-of-electronic-assemblies\/","title":{"rendered":"Test Laboratory: Cross-Sections of Electronic Assemblies"},"content":{"rendered":"<div id=\"pl-13722\"  class=\"panel-layout\" ><div id=\"pg-13722-0\"  class=\"panel-grid panel-has-style\" ><div class=\"header-slider panel-row-style panel-row-style-for-13722-0\" ><div id=\"pgc-13722-0-0\"  class=\"panel-grid-cell\" ><div id=\"panel-13722-0-0-0\" class=\"so-panel widget widget_sow-editor panel-first-child panel-last-child\" data-index=\"0\" ><div\n\t\t\t\n\t\t\tclass=\"so-widget-sow-editor so-widget-sow-editor-base\"\n\t\t\t\n\t\t>\n<div class=\"siteorigin-widget-tinymce textwidget\">\n\t<div id=\"metaslider-id-13832\" style=\"width: 100%;\" class=\"ml-slider-3-113-1 metaslider metaslider-flex metaslider-13832 ml-slider ms-theme-default nav-hidden\" role=\"region\" aria-label=\"Pr\u00fcflabor Schliffe elektr. Baugruppen Head EN\" data-height=\"965\" data-width=\"1920\">\n    <div id=\"metaslider_container_13832\">\n        <div id=\"metaslider_13832\">\n            <ul class='slides'>\n                <li style=\"display: block; width: 100%;\" class=\"slide-13834 ms-image \" aria-roledescription=\"slide\" data-date=\"2026-06-22 16:05:44\" data-filename=\"Schlifferstellung-e1709800713345-1410x708.webp\" data-slide-type=\"image\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/www.encontec.de\/wp-content\/uploads\/2024\/12\/Schlifferstellung-e1709800713345-1410x708.webp\" height=\"965\" width=\"1920\" alt=\"\" class=\"slider-13832 slide-13834 msDefaultImage\" title=\"Schlifferstellung-e1709800713345\" \/><div class=\"caption-wrap\"><div class=\"caption\"><div class=\"caption-inner\"> <div class=\"header-slider-text\"> <p class=\"slidergross\">Polish analysis of electronic assemblies and semiconductors<\/p> <\/div> <\/div><\/div><\/div><\/li>\n            <\/ul>\n        <\/div>\n        \n    <\/div>\n<\/div>\n<\/div>\n<\/div><\/div><\/div><\/div><\/div><div id=\"pg-13722-1\"  class=\"panel-grid panel-has-style\" ><div class=\"default-space-big container panel-row-style panel-row-style-for-13722-1\" ><div id=\"pgc-13722-1-0\"  class=\"panel-grid-cell\" ><div id=\"panel-13722-1-0-0\" class=\"so-panel widget widget_sow-editor panel-first-child panel-last-child\" data-index=\"1\" ><div class=\"seo-text panel-widget-style panel-widget-style-for-13722-1-0-0\" ><div\n\t\t\t\n\t\t\tclass=\"so-widget-sow-editor so-widget-sow-editor-base\"\n\t\t\t\n\t\t>\n<div class=\"siteorigin-widget-tinymce textwidget\">\n\t<h1>Test Laboratory for Cross-Section Analysis of Electronic Assemblies & Semiconductors <\/h1>\n<p>We perform high-precision cross-sections on electronic assemblies, printed circuit boards, and contact points to reveal solder joints, cracks, delaminations, and layer structures. In our testing laboratory, cross-section analysis enables us to conduct a detailed assessment of manufacturing quality, reliability, and failure mechanisms\u2014ideal for development, quality assurance, and complaint handling. Explanation: For cross-section analysis, samples are first extracted from electronic assemblies or printed circuit boards and embedded in synthetic resin so that solder joints, layer thicknesses, cracks, crimp connections, or the internal structure can be precisely evaluated under a microscope.  <\/p>\n<\/div>\n<\/div><\/div><\/div><\/div><\/div><\/div><div id=\"pg-13722-2\"  class=\"panel-grid panel-has-style\" ><div class=\"anwendungen-wrap anwendungen-wrap-reverse panel-row-style panel-row-style-for-13722-2\" ><div id=\"pgc-13722-2-0\"  class=\"panel-grid-cell\" ><div id=\"panel-13722-2-0-0\" class=\"so-panel widget widget_sow-editor panel-first-child panel-last-child\" data-index=\"2\" ><div class=\"text-wrap normal-list panel-widget-style panel-widget-style-for-13722-2-0-0\" ><div\n\t\t\t\n\t\t\tclass=\"so-widget-sow-editor so-widget-sow-editor-base\"\n\t\t\t\n\t\t>\n<div class=\"siteorigin-widget-tinymce textwidget\">\n\t<div class=\"text-wrap-inner\">\n<h3 style=\"color: #ffffff;\">At a Glance<\/h3>\n<p>Microstructural analyses can be used to identify and verify manufacturing defects and failure mechanisms beyond a doubt:<\/p>\n<ul>\n<li><strong>Assemblies & Printed Circuit Boards:<\/strong> Measurement of, for example, copper layer thicknesses, insulation clearances (prepreg), and the quality of through-holes (vias).<\/li>\n<li><strong>Solder Joint Analysis:<\/strong> Inspection for wetting, porosity (gas inclusions), cracks (e.g., caused by thermal cycling), and intermetallic phases.<\/li>\n<li><strong>Crimp and press-fit connections:<\/strong> Check whether the strands in the crimp contact are optimally formed and whether the press-fit pins in the printed circuit board have the required positive fit.<\/li>\n<\/ul>\n<\/div>\n<\/div>\n<\/div><\/div><\/div><\/div><div id=\"pgc-13722-2-1\"  class=\"panel-grid-cell\" ><div id=\"panel-13722-2-1-0\" class=\"so-panel widget widget_sow-editor panel-first-child panel-last-child\" data-index=\"3\" ><div class=\"image-wrap panel-widget-style panel-widget-style-for-13722-2-1-0\" ><div\n\t\t\t\n\t\t\tclass=\"so-widget-sow-editor so-widget-sow-editor-base\"\n\t\t\t\n\t\t>\n<div class=\"siteorigin-widget-tinymce textwidget\">\n\t<p><img decoding=\"async\" class=\"alignnone size-full wp-image-12419\" src=\"\/wp-content\/uploads\/2024\/12\/Schlifferstellung-e1709800713345.webp\" alt=\"\"><\/p>\n<\/div>\n<\/div><\/div><\/div><\/div><\/div><\/div><div id=\"pg-13722-3\"  class=\"panel-grid panel-has-style\" ><div class=\"default-space container space-bottom  panel-row-style panel-row-style-for-13722-3\" ><div id=\"pgc-13722-3-0\"  class=\"panel-grid-cell\" ><div id=\"panel-13722-3-0-0\" class=\"so-panel widget widget_sow-editor panel-first-child panel-last-child\" data-index=\"4\" ><div\n\t\t\t\n\t\t\tclass=\"so-widget-sow-editor so-widget-sow-editor-base\"\n\t\t\t\n\t\t>\n<div class=\"siteorigin-widget-tinymce textwidget\">\n\t<h2>Typical applications in electronics testing:<\/h2>\n<ul style=\"margin-left: 20px;\">\n<li>Analysis of Solder Joints (THT, SMT, BGA)<\/li>\n<li>Evaluation of Delamination, Voids, and Porosity<\/li>\n<li>Investigation of cracks in conductor traces, pads, or through-holes<\/li>\n<li>Inspection of contact points, bond connections, and current paths<\/li>\n<li>Troubleshooting for Outages, Malfunctions, or Thermal Issues<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<h2>Scope of Services:<\/h2>\n<ul style=\"margin-left: 20px;\">\n<li>Precise grinding preparation (cutting, embedding, grinding, polishing)<\/li>\n<li>Depiction of solder joints, coating systems, and interfaces<\/li>\n<li>Crack measurement according to an accredited in-house procedure<\/li>\n<li><a href=\"https:\/\/www.encontec.de\/en\/testing-laboratory-for-surface-analysis-microscopy\/testing-laboratory-sem-edx-analysis\/\" style=\"text-decoration: underline;\">SEM and EDX analysis<\/a> as needed<\/li>\n<li>Documentation of all relevant findings<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<h2>Result:<\/h2>\n<ul style=\"margin-left: 20px;\">\n<li>High-resolution micrographs<\/li>\n<li>Evaluation of Solder Joint Quality, Material Condition, and Defects<\/li>\n<li>Identification of cracks, delaminations, or manufacturing defects<\/li>\n<li>Clear recommendations for action in the areas of development, manufacturing, or quality assurance<\/li>\n<\/ul>\n<\/div>\n<\/div><\/div><\/div><\/div><\/div><div id=\"pg-13722-4\"  class=\"panel-grid panel-has-style\" ><div class=\"default-space container no-space-top default-space-bottom  panel-row-style panel-row-style-for-13722-4\" ><div id=\"pgc-13722-4-0\"  class=\"panel-grid-cell\" ><div id=\"panel-13722-4-0-0\" class=\"so-panel widget widget_sow-button panel-first-child panel-last-child\" data-index=\"5\" ><div class=\"no panel-widget-style panel-widget-style-for-13722-4-0-0\" ><div\n\t\t\t\n\t\t\tclass=\"so-widget-sow-button so-widget-sow-button-flat-66466acb9e12-13722\"\n\t\t\t\n\t\t><div class=\"ow-button-base ow-button-align-center\"\n>\n\t\t\t<a\n\t\t\t\t\thref=\"https:\/\/www.encontec.de\/kontakt\/\"\n\t\t\t\t\tclass=\"sowb-button ow-icon-placement-left ow-button-hover\" \t>\n\t\t<span>\n\t\t\t\n\t\t\tTo the inquiry\t\t<\/span>\n\t\t\t<\/a>\n\t<\/div>\n<\/div><\/div><\/div><\/div><\/div><\/div><\/div>","protected":false},"excerpt":{"rendered":"<p>Test Laboratory for Cross-Section Analysis of Electronic Assemblies &#038; Semiconductors We perform high-precision cross-sections on electronic assemblies, printed circuit boards, and contact points to reveal solder joints, cracks, delaminations, and layer structures. In our testing laboratory, cross-section analysis enables us to conduct a detailed assessment of manufacturing quality, reliability, and failure mechanisms\u2014ideal for development, quality &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.encontec.de\/en\/testing-laboratory\/electronics-testing-laboratory-ipc-a-600-a-610\/test-laboratory-cross-sections-of-electronic-assemblies\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Test Laboratory: Cross-Sections of Electronic Assemblies&#8221;<\/span><\/a><\/p>\n","protected":false},"author":11,"featured_media":0,"parent":13708,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"inline_featured_image":false,"_monsterinsights_skip_tracking":false,"_uf_show_specific_survey":0,"_uf_disable_surveys":false,"footnotes":""},"class_list":["post-13722","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/www.encontec.de\/en\/wp-json\/wp\/v2\/pages\/13722","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.encontec.de\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.encontec.de\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.encontec.de\/en\/wp-json\/wp\/v2\/users\/11"}],"replies":[{"embeddable":true,"href":"https:\/\/www.encontec.de\/en\/wp-json\/wp\/v2\/comments?post=13722"}],"version-history":[{"count":2,"href":"https:\/\/www.encontec.de\/en\/wp-json\/wp\/v2\/pages\/13722\/revisions"}],"predecessor-version":[{"id":13894,"href":"https:\/\/www.encontec.de\/en\/wp-json\/wp\/v2\/pages\/13722\/revisions\/13894"}],"up":[{"embeddable":true,"href":"https:\/\/www.encontec.de\/en\/wp-json\/wp\/v2\/pages\/13708"}],"wp:attachment":[{"href":"https:\/\/www.encontec.de\/en\/wp-json\/wp\/v2\/media?parent=13722"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}