{"id":13723,"date":"2026-05-21T17:30:42","date_gmt":"2026-05-21T15:30:42","guid":{"rendered":"https:\/\/www.encontec.de\/electronics-testing-laboratory-ipc-a-600-a-610\/test-laboratory-whisker-analysis\/"},"modified":"2026-06-23T10:42:58","modified_gmt":"2026-06-23T08:42:58","slug":"test-laboratory-whisker-analysis","status":"publish","type":"page","link":"https:\/\/www.encontec.de\/en\/testing-laboratory\/electronics-testing-laboratory-ipc-a-600-a-610\/test-laboratory-whisker-analysis\/","title":{"rendered":"Test Laboratory: Whisker Analysis"},"content":{"rendered":"<div id=\"pl-13723\"  class=\"panel-layout\" ><div id=\"pg-13723-0\"  class=\"panel-grid panel-has-style\" ><div class=\"header-slider panel-row-style panel-row-style-for-13723-0\" ><div id=\"pgc-13723-0-0\"  class=\"panel-grid-cell\" ><div id=\"panel-13723-0-0-0\" class=\"so-panel widget widget_sow-editor panel-first-child panel-last-child\" data-index=\"0\" ><div\n\t\t\t\n\t\t\tclass=\"so-widget-sow-editor so-widget-sow-editor-base\"\n\t\t\t\n\t\t>\n<div class=\"siteorigin-widget-tinymce textwidget\">\n\t<div id=\"metaslider-id-13837\" style=\"width: 100%;\" class=\"ml-slider-3-113-0 metaslider metaslider-flex metaslider-13837 ml-slider ms-theme-default nav-hidden\" role=\"region\" aria-label=\"Pr\u00fcflabor Whiskeranalyse Head EN\" data-height=\"965\" data-width=\"1920\">\n    <div id=\"metaslider_container_13837\">\n        <div id=\"metaslider_13837\">\n            <ul class='slides'>\n                <li style=\"display: block; width: 100%;\" class=\"slide-13839 ms-image \" aria-roledescription=\"slide\" data-date=\"2026-06-22 16:12:42\" data-filename=\"whiskeranalyse-header.webp\" data-slide-type=\"image\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/www.encontec.de\/wp-content\/uploads\/2026\/05\/whiskeranalyse-header.webp\" height=\"965\" width=\"1920\" alt=\"\" class=\"slider-13837 slide-13839 msDefaultImage\" title=\"whiskeranalyse-header\" \/><div class=\"caption-wrap\"><div class=\"caption\"><div class=\"caption-inner\"> <div class=\"header-slider-text\"> <p class=\"slidergross\">Whisker Analysis<\/p> <p class=\"slidernormal\">Don\u2019t give tin whiskers a chance<\/p> <\/div> <\/div><\/div><\/div><\/li>\n            <\/ul>\n        <\/div>\n        \n    <\/div>\n<\/div>\n<\/div>\n<\/div><\/div><\/div><\/div><\/div><div id=\"pg-13723-1\"  class=\"panel-grid panel-has-style\" ><div class=\"default-space-big container panel-row-style panel-row-style-for-13723-1\" ><div id=\"pgc-13723-1-0\"  class=\"panel-grid-cell\" ><div id=\"panel-13723-1-0-0\" class=\"so-panel widget widget_sow-editor panel-first-child panel-last-child\" data-index=\"1\" ><div class=\"seo-text panel-widget-style panel-widget-style-for-13723-1-0-0\" ><div\n\t\t\t\n\t\t\tclass=\"so-widget-sow-editor so-widget-sow-editor-base\"\n\t\t\t\n\t\t>\n<div class=\"siteorigin-widget-tinymce textwidget\">\n\t<h1>Test Laboratory: Whisker Analysis<\/h1>\n<p>We detect, analyze, measure, and evaluate whisker growth on electronic assemblies, components, and surfaces. Tin whiskers can cause short circuits, intermittent faults, and failures\u2014especially in safety-critical applications. Using high-resolution microscopy and <a href=\"https:\/\/www.encontec.de\/en\/testing-laboratory-for-surface-analysis-microscopy\/testing-laboratory-sem-edx-analysis\/\" style=\"text-decoration: underline;\">SEM\/EDX analysis<\/a>, we identify whiskers, determine their morphology, and assess the risk to your product.  <\/p>\n<\/div>\n<\/div><\/div><\/div><\/div><\/div><\/div><div id=\"pg-13723-2\"  class=\"panel-grid panel-has-style\" ><div class=\"anwendungen-wrap anwendungen-wrap-reverse panel-row-style panel-row-style-for-13723-2\" ><div id=\"pgc-13723-2-0\"  class=\"panel-grid-cell\" ><div id=\"panel-13723-2-0-0\" class=\"so-panel widget widget_sow-editor panel-first-child panel-last-child\" data-index=\"2\" ><div class=\"text-wrap normal-list panel-widget-style panel-widget-style-for-13723-2-0-0\" ><div\n\t\t\t\n\t\t\tclass=\"so-widget-sow-editor so-widget-sow-editor-base\"\n\t\t\t\n\t\t>\n<div class=\"siteorigin-widget-tinymce textwidget\">\n\t<div class=\"text-wrap-inner\">\n<h3 style=\"color: #ffffff;\">ADVANTAGES OF WHISKER ANALYSIS<\/h3>\n<p>Whiskers are microscopically fine, hair- or needle-shaped metal crystals. Whiskers that grow in an electrical circuit or connection point often cause electrical products to fail. We use our expertise in whisker analysis to examine your components with state-of-the-art laboratory equipment and determine the presence, length, and location of whiskers. The analysis and prevention of whisker growth are fundamental to the safety and reliability of electrical products.   <\/p>\n<\/div>\n<\/div>\n<\/div><\/div><\/div><\/div><div id=\"pgc-13723-2-1\"  class=\"panel-grid-cell\" ><div id=\"panel-13723-2-1-0\" class=\"so-panel widget widget_sow-editor panel-first-child panel-last-child\" data-index=\"3\" ><div class=\"image-wrap panel-widget-style panel-widget-style-for-13723-2-1-0\" ><div\n\t\t\t\n\t\t\tclass=\"so-widget-sow-editor so-widget-sow-editor-base\"\n\t\t\t\n\t\t>\n<div class=\"siteorigin-widget-tinymce textwidget\">\n\t<p><img decoding=\"async\" class=\"alignnone size-full wp-image-12419\" src=\"\/wp-content\/uploads\/2024\/12\/whiskeranalyse.webp\" alt=\"\"><\/p>\n<\/div>\n<\/div><\/div><\/div><\/div><\/div><\/div><div id=\"pg-13723-3\"  class=\"panel-grid panel-has-style\" ><div class=\"default-space container space-bottom  panel-row-style panel-row-style-for-13723-3\" ><div id=\"pgc-13723-3-0\"  class=\"panel-grid-cell\" ><div id=\"panel-13723-3-0-0\" class=\"so-panel widget widget_sow-editor panel-first-child panel-last-child\" data-index=\"4\" ><div\n\t\t\t\n\t\t\tclass=\"so-widget-sow-editor so-widget-sow-editor-base\"\n\t\t\t\n\t\t>\n<div class=\"siteorigin-widget-tinymce textwidget\">\n\t<h2>Typical use cases:<\/h2>\n<ul style=\"margin-left: 20px;\">\n<li>Detection of Tin Whiskers on Surfaces and Solder Joints<\/li>\n<li>Evaluation of Whisker Growth Under Temperature, Humidity, or Vibration Stress<\/li>\n<li>Analysis of Failures Caused by Short Circuits or Intermittent Faults<\/li>\n<li>Investigation of Coatings, Surface Finishes, and Material Combinations<\/li>\n<li>Risk Assessment for Automotive, Industrial, and Medical Electronics<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<h2>Scope of Services:<\/h2>\n<ul style=\"margin-left: 20px;\">\n<li>Visual Inspection Using Reflected Light and Digital Microscopy<\/li>\n<li><a href=\"https:\/\/www.encontec.de\/en\/testing-laboratory-for-surface-analysis-microscopy\/scanning-electron-microscopy-testing-laboratory\/\" style=\"text-decoration: underline;\">SEM Analysis<\/a> for Visualizing the Finest Whisker Structures<\/li>\n<li><a href=\"https:\/\/www.encontec.de\/en\/testing-laboratory-edx-analysis\/\" style=\"text-decoration: underline;\">EDX Elemental Analysis<\/a> to Confirm Material Composition<\/li>\n<li>Measurement of length, density, and morphology; documentation of all findings with images<\/li>\n<li>Documentation<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<h2>Result:<\/h2>\n<ul style=\"margin-left: 20px;\">\n<li>Reliable Detection of Whiskers and Potential Risk Areas<\/li>\n<li>Assessment of Whisker Growth and Possible Failure Mechanisms<\/li>\n<li>High-resolution image documentation<\/li>\n<li>Recommendations for Reducing or Preventing Whisker Formation<\/li>\n<\/ul>\n<\/div>\n<\/div><\/div><\/div><\/div><\/div><div id=\"pg-13723-4\"  class=\"panel-grid panel-has-style\" ><div class=\"default-space container no-space-top default-space-bottom  panel-row-style panel-row-style-for-13723-4\" ><div id=\"pgc-13723-4-0\"  class=\"panel-grid-cell\" ><div id=\"panel-13723-4-0-0\" class=\"so-panel widget widget_sow-button panel-first-child panel-last-child\" data-index=\"5\" ><div class=\"no panel-widget-style panel-widget-style-for-13723-4-0-0\" ><div\n\t\t\t\n\t\t\tclass=\"so-widget-sow-button so-widget-sow-button-flat-66466acb9e12-13723\"\n\t\t\t\n\t\t><div class=\"ow-button-base ow-button-align-center\"\n>\n\t\t\t<a\n\t\t\t\t\thref=\"https:\/\/www.encontec.de\/kontakt\/\"\n\t\t\t\t\tclass=\"sowb-button ow-icon-placement-left ow-button-hover\" \t>\n\t\t<span>\n\t\t\t\n\t\t\tTo the inquiry\t\t<\/span>\n\t\t\t<\/a>\n\t<\/div>\n<\/div><\/div><\/div><\/div><\/div><\/div><\/div>","protected":false},"excerpt":{"rendered":"<p>Test Laboratory: Whisker Analysis We detect, analyze, measure, and evaluate whisker growth on electronic assemblies, components, and surfaces. Tin whiskers can cause short circuits, intermittent faults, and failures\u2014especially in safety-critical applications. Using high-resolution microscopy and SEM\/EDX analysis, we identify whiskers, determine their morphology, and assess the risk to your product.<\/p>\n","protected":false},"author":11,"featured_media":0,"parent":13708,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"inline_featured_image":false,"_monsterinsights_skip_tracking":false,"_uf_show_specific_survey":0,"_uf_disable_surveys":false,"footnotes":""},"class_list":["post-13723","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/www.encontec.de\/en\/wp-json\/wp\/v2\/pages\/13723","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.encontec.de\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.encontec.de\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.encontec.de\/en\/wp-json\/wp\/v2\/users\/11"}],"replies":[{"embeddable":true,"href":"https:\/\/www.encontec.de\/en\/wp-json\/wp\/v2\/comments?post=13723"}],"version-history":[{"count":2,"href":"https:\/\/www.encontec.de\/en\/wp-json\/wp\/v2\/pages\/13723\/revisions"}],"predecessor-version":[{"id":13895,"href":"https:\/\/www.encontec.de\/en\/wp-json\/wp\/v2\/pages\/13723\/revisions\/13895"}],"up":[{"embeddable":true,"href":"https:\/\/www.encontec.de\/en\/wp-json\/wp\/v2\/pages\/13708"}],"wp:attachment":[{"href":"https:\/\/www.encontec.de\/en\/wp-json\/wp\/v2\/media?parent=13723"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}