Ground joint position
Ground joint position
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Weld seam analysis
Weld seam analysis
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Microstructure analysis
Microstructure analysis
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Material analysis
Material analysis
MoreVisual inspection
Visual inspection
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Diagnosis of test specimens
Diagnosis of test specimens
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REM
REM
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EDX analysis
EDX analysis
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Whisker analysis
Whisker analysis
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Damage analysis
Damage analysis
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Fracture surface analysis
Fracture surface analysis
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Surface topography / LSM
Surface topography / LSM
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Roughness measurement
Roughness measurement
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Hardness test
Hardness test
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Tensile and pressure testing
Tensile and pressure testing
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Leak test / Bubble test
Leak test / Bubble test
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Ground joint position
The creation of sophisticated cuts on electronic components and the precise assessment of the connection to the circuit board are part of our expertise, as is the creation of cuts on any other components. We carry out a thorough analysis of cracks, crack patterns and pores in solder joints to ensure that your electronic assemblies are free of defects. With our accredited in-house procedure for the measurement of cracks in solder joints, we offer you a professional and reliable standard for the quality control of your components.
Weld seam analysis
Are you looking for precise and reliable analyses of weld seams? Then you've come to the right place!
Our experts in the laboratory provide you with detailed insights into the quality and integrity of your weld seams. With our weld seam analysis, you can detect potential defects at an early stage, improve the strength and durability of your welds and thus save costs. Whether MIG/MAG, TIG, manual arc welding, laser welding or other welding processes - we offer you customized weld seam analyses for every application.
Microstructure analysis
We offer precise analysis of material structures for metals, ceramics, polymers and composites. We provide sound insights into the structure, composition and properties of your samples. Identify quality problems, investigate damage and uncover optimization potential.
Material analysis
With our material analysis, we offer a precise examination of the composition of your materials. We identify and analyze inclusions, precipitates, signs of corrosion, stains, impurities, grain sizes and grain size distributions. Using various modern methods, we precisely determine the chemical composition of your materials and provide you with detailed insights.
Visual inspection
We specialize in the visual analysis of electronic components, assemblies and printed circuit boards after product testing or in the event of damage. With many years of experience and expertise, we carry out visual inspections in accordance with the IPC-A610 and IPC-A600 standards. We also provide analyses in accordance with our accredited in-house procedure or adapt to your individual requirements. With state-of-the-art technologies and a trained eye, we ensure that your components and assemblies meet the highest quality standards.
Diagnosis of test specimens
Our test item diagnostics ensure precise analysis of your test results. We identify defects or deviations and carefully evaluate their impact on the quality of your products. Based on these findings, we develop customized measures to continuously improve your product quality.
Scanning electron microscopy
With our scanning electron microscopy, you can view the smallest particles, surfaces and materials with unprecedented sharpness and magnification. Use our services to optimize your research results and gain new insights. Thanks to the EDX detector, we can not only visualize surface structures, but also determine the chemical composition of samples.
The CL detector can be used to identify fluorescent plastic layers or cracks. Fluorescent minerals can also be examined.
EDX analysis
Our EDX analysis (energy dispersive X-ray spectroscopy) enables precise analysis of your materials. This method enables us to precisely determine the material composition and carry out a thorough analysis. This gives you detailed insights into the chemical properties of your samples.
Whisker analysis
Whiskers growing in an electrical circuit or a connection section can cause short circuits that can lead to failures of electrical products.
The analysis and prevention of whisker growth are therefore crucial for the safety and reliability of electrical products. We have in-depth expertise in the analysis of whiskers. Using our state-of-the-art laboratory equipment, we examine your components and determine the presence, length and location of whiskers
Damage analysis
With our damage analysis services, we support you in finding the cause of the defect. Using state-of-the-art technologies such as scanning electron microscopy, hardness tests, visual analyses, EDX analyses, roughness tests and much more, we offer you all the necessary analyses. Regardless of your industry, we are your partner for reliable analyses.
Fracture surface analysis
Our portfolio includes precise examinations of fracture surfaces of various materials to help you identify the causes of damage and develop preventive measures. We analyze fracture surfaces of metals, plastics, ceramics and composites to help you solve quality problems and ensure the safety of your products.
Surface topography / LSM
Our modern laser scanning microscope enables you to visualize and analyse the finest details and structures on surfaces. In addition, it offers the unique possibility of measuring the surface roughness in the radius and thus carrying out a comprehensive characterization of the surface. We can visualize and analyse the captured data for you in impressive 3D representations. The finest details and structures are made visible.
Roughness measurement
Our roughness measurements are carried out using a tactile measuring machine in accordance with DIN EN ISO 21920-2. We offer you a reliable solution for checking the surface quality of your components. It is also possible to test the roughness in the radius with our LSM microscope.
Hardness test
The Vickers hardness test in accordance with DIN EN ISO 6507-1 is a standardized method for measuring the surface hardness of metals, ceramics and other materials (measuring range: between HV 0.05 and HV 10). Our experts carry out this test with the highest accuracy to provide you with detailed information about the mechanical properties of your samples. Place your trust in our expertise!
Tensile and pressure testing
Our tensile and compression tests allow us to reliably determine the mechanical properties of materials such as tensile strength, elongation at break, yield strength and compressive strength. We are particularly specialized in measuring press-out forces on the pins of the male connectors of control units. We manufacture the corresponding devices in-house.
Leak test / bubble test
Our Bubble Emission Test System, BETty, is a water bath leak detection system used to locate leaks in all flexible and rigid packaging types and various components. With its precise technology, BETty provides a reliable method to identify leaks quickly and efficiently, contributing to improved product quality and
safety.
