News
News at encontec
22.08.2025
Our test laboratory is growing for you
We have expanded our test laboratory and now offer you even more capacity for material analyses, grinding of electronic components and weld seam analyses.
New: Separation of dirty and clean areas. This allows us to achieve an even higher quality of sanding.
More space. More precision. More quality.
Your partner for reliable testing
07.07.2025
TÜV confirms: Successful ISO 9001 audit
Our quality management was once again audited by TÜV in accordance with DIN ISO 9001 - without any complaints.
This confirms our high standards and reliability for our customers.
encontec GmbH - certified quality you can rely on.
13.06.2025
Follow us on LinkedIn - stay in touch with us
Whether test laboratory, DLC coating or engineering - encontec GmbH stands for competence, quality and customer orientation in all our service areas.
You can now also find us on LinkedIn, where we regularly report on news from our company
Follow us and stay up to date about
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Current projects and technical innovations
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Practical solutions for our customers
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Team news, success stories and events
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Vacancies and career opportunities
Network now - we look forward to exchanging ideas with you
👉 Follow encontec GmbH on LinkedIn
12.04.2025
Accreditation according to DIN EN ISO/IEC 17025:2018 successfully confirmed
We are delighted that our testing laboratory has once again been successfully audited by the German Accreditation Body (DAkkS) and that accreditation in accordance with DIN EN ISO/IEC 17025:2018 has been confirmed. this award confirms once again that our analyses meet the highest quality standards - reliable, reproducible and in compliance with standards. Our focus is on the analysis of electronic components and assemblies after testing and the assessment of weld seams. Whether for damage analysis, quality assurance or research and development - we deliver reliable results that you can rely on.
Take advantage of our expertise for your projects - we will be happy to advise you personally.