Test Laboratory for Cross-Section Analysis of Electronic Assemblies & Semiconductors

We perform high-precision cross-sections on electronic assemblies, printed circuit boards, and contact points to reveal solder joints, cracks, delaminations, and layer structures. In our testing laboratory, cross-section analysis enables us to conduct a detailed assessment of manufacturing quality, reliability, and failure mechanisms—ideal for development, quality assurance, and complaint handling. Explanation: For cross-section analysis, samples are first extracted from electronic assemblies or printed circuit boards and embedded in synthetic resin so that solder joints, layer thicknesses, cracks, crimp connections, or the internal structure can be precisely evaluated under a microscope.

At a Glance

Microstructural analyses can be used to identify and verify manufacturing defects and failure mechanisms beyond a doubt:

  • Assemblies & Printed Circuit Boards: Measurement of, for example, copper layer thicknesses, insulation clearances (prepreg), and the quality of through-holes (vias).
  • Solder Joint Analysis: Inspection for wetting, porosity (gas inclusions), cracks (e.g., caused by thermal cycling), and intermetallic phases.
  • Crimp and press-fit connections: Check whether the strands in the crimp contact are optimally formed and whether the press-fit pins in the printed circuit board have the required positive fit.

Typical applications in electronics testing:

  • Analysis of Solder Joints (THT, SMT, BGA)
  • Evaluation of Delamination, Voids, and Porosity
  • Investigation of cracks in conductor traces, pads, or through-holes
  • Inspection of contact points, bond connections, and current paths
  • Troubleshooting for Outages, Malfunctions, or Thermal Issues

 

Scope of Services:

  • Precise grinding preparation (cutting, embedding, grinding, polishing)
  • Depiction of solder joints, coating systems, and interfaces
  • Crack measurement according to an accredited in-house procedure
  • SEM and EDX analysis as needed
  • Documentation of all relevant findings

 

Result:

  • High-resolution micrographs
  • Evaluation of Solder Joint Quality, Material Condition, and Defects
  • Identification of cracks, delaminations, or manufacturing defects
  • Clear recommendations for action in the areas of development, manufacturing, or quality assurance